Precision & Assembly Matching

In electronic product development, first-time fit rate is critical. We focus on precision machining tailored to real assembly scenarios - ensuring PCB mounting holes, connector interfaces, and shielding cavities align correctly on the first try, reducing iteration and assembly issues.

Positional Tolerances for PCB Mounting Holes

Using unified datums and deviation-compensation strategies, we typically hold hole-diameter tolerance of ±0.02 mm and positional tolerance of ±0.05 mm (Ø position-tolerance zone), supporting stress-free PCB installation. Tighter values can be quoted on request.

Connector Interface Matching - Flanges, Threads & Mating Surfaces

Precision machining for RF, D-SUB, M12, and similar connectors. We hold ISO 965 6H/6g thread fits and coaxiality within 0.02 mm on critical features for reliable signal transmission and mechanical mating.

CMM Inspection & First-Article Reports

100% CMM inspection on critical dimensions with detailed FAI reports provided for first articles - meeting the traceability requirements of electronic OEMs.

Tolerance Capability Comparison

Feature	General Machining (ISO 2768-mK)	Our Capability	Notes
Hole diameter tolerance	±0.1 mm	±0.02 mm	Higher first-time fit rate
Hole position tolerance	±0.1–0.2 mm	±0.05 mm	Tighter alignment for connectors
Thread fit	ISO 965 6H/6g	ISO 965 6H/6g	Reliable and consistent
Flatness (sealing surface)	0.05–0.1 mm	0.02 mm	Better EMI sealing performance

Reference standard updated to ISO 2768 (general machining tolerances); previous reference to IPC-2222 was incorrect - IPC-2222 covers PCB design rather than CNC tolerances.

EMI / EMC Requirements

EMI/EMC performance depends heavily on the structural integrity and electrical continuity of machined parts. We engineer enclosures that help your product pass FCC Part 15, EN 55032, and similar EMC tests.

EMI Shielding Enclosure Machining

Strict gap control (apertures kept well below λ/20 at the highest frequency of concern) and reliable conductive continuity between mating surfaces. Capabilities include complex multi-cavity shielding structures with verified grounding paths.

Gasket Groove Precision for EMI Sealing

Gasket-groove tolerances controlled to within ±0.05 mm to achieve target compression. We work with beryllium-copper finger stock, conductive elastomers, and conductive foam, and tune groove geometry to each gasket type.

Ground-Plane Continuity - Surface-Treatment Considerations

We help you choose between conductive surface treatments (chemical conversion coatings such as alodine/chromate, conductive anodizing, electroless nickel) and standard insulating anodizing. Selecting the wrong treatment is a frequent cause of grounding failures in EMI designs - we flag this risk during DFM.

Material Selection

We recommend materials based on functional needs - thermal management, EMI shielding, insulation, environmental resistance - rather than price alone.

Aluminum Alloys - 6061-T6 & 6063 for Enclosures

6061-T6 offers good strength and machinability with thermal conductivity ~167 W/(m·K), well-suited to RF module housings and heatsink bases. 6063 typically anodizes to a more uniform appearance for visible enclosures.

Copper & Brass - C101 / C360 for Electrical Contacts

C101 (oxygen-free electronic copper) achieves electrical conductivity of ~101% IACS, suitable for high-current contacts and busbars. C360 brass offers a balanced combination of conductivity and machinability for connectors and terminals.

Stainless Steel - 316L for Harsh Environments

Used in medical electronics, industrial control boxes, and marine applications. Its non-magnetic structure minimizes interference in EMI-sensitive designs.

Engineering Plastics - PEEK, POM, FR-4–Compatible Resins

Used for insulating components, connector bodies, and high-frequency substrate supports. UL 94 V-0 flame-retardant grades are available for applications requiring controlled flammability behavior.

Micro-Feature Machining

As electronic devices shrink, we deliver reliable micro-machining capabilities:

Minimum feature size: minimum inner radius R0.3 mm, minimum wall thickness 0.3 mm (aluminum) / 0.5 mm (plastic), aspect ratio up to ~8:1
Fine thread milling: M1.2 to M3 threads in aluminum - suitable for compact handheld devices and precision instruments
Complex internal cavities: multi-cavity RF and microwave modules with cavity flatness ≤0.01 mm and tight corner-radius control to manage resonance behavior
Tight-pitch hole patterns: minimum hole-to-hole spacing 0.8 mm; minimum hole diameter Ø0.5 mm with tight perpendicularity and positional accuracy

Surface Quality

In electronics, surface quality is functional, not just cosmetic:

Ra targets by function: Ra 0.8 μm for sealing surfaces, Ra 1.6 μm for general mating surfaces, Ra 3.2 μm for cosmetic surfaces

Flatness & parallelism: heatsink mounting surface flatness ≤0.02 mm to ensure uniform TIM thickness and lower thermal resistance

Burr-free finishing: critical to prevent shorts. Ultrasonic cleaning, electrolytic deburring, and cleanroom-grade packaging available.

Surface Treatments & Secondary Operations

Complete in-house finishing and secondary operations to simplify your supply chain:

Conductive surface treatments vs hard anodizing (Type III):

chromate / alodine conversion coatings preserve surface conductivity for EMI grounding; Type III anodizing offers high wear resistance but is electrically insulating. We define application boundaries clearly.

Electroless nickel plating:

uniform coating (typical ±2 μm), suitable for complex internal cavity walls.

Selective gold plating:

applied only on contact areas to control cost while maintaining low contact resistance.

Passivation, chromate & RoHS-compliant treatments:

full documentation for REACH and RoHS compliance.

Secondary operations:

heat-staked inserts, laser marking, silk-screening, and cleanroom packaging.

FAQ

Q1: Can you machine EMI shielding enclosures with gasket grooves?

Yes. We have extensive experience machining EMI shielding enclosures with precise gasket grooves to deliver target compression and shielding effectiveness for FCC and CE compliance.

Q2: What is the tightest tolerance you can hold on aluminum electronic housings?

General tolerances of ±0.025–0.05 mm; ±0.01 mm achievable on critical features and ±0.005 mm available on selected features with grinding or lapping. The achievable value depends on part geometry.

Q3: Do you provide material and RoHS-compliance certificates?

Yes. Material certificates and RoHS compliance reports are provided on request.

Q4: Can you machine parts under 10 mm with M1.6 threads?

Yes. We specialize in micro-machining and can produce M1.2 to M3 threads in small components for compact electronic devices.

Q5: What is the difference between conductive surface treatments and standard Type II anodizing?

Conductive treatments (chemical conversion coatings such as chromate / alodine) maintain surface conductivity for EMI grounding, while standard Type II anodizing creates an insulating oxide layer. We recommend the right treatment based on your specific EMI/EMC requirements.

Q6: Can you do cleanroom packaging for medical electronics?

Yes. We offer cleanroom packaging (ISO Class 7 or higher) for sensitive medical and electronic components.

Q7: What file formats do you accept?

STEP, IGES, DXF, SolidWorks (.sldprt), and Parasolid.

Q8: What is the typical lead time for prototype electronic enclosures?

Standard prototypes take 5–7 working days. Complex EMI shielding enclosures may require 7–10 working days following DFM review.

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